DANIEL SO
Acupuncture at Su Siempre Pl, Escondido, CA
License number
California 16322
Category
Acupuncture
Type
Acupuncturist
Address
Address
2956 Su Siempre Pl, Escondido, CA 92025
Phone
(949) 233-2182
(760) 747-5143 (Fax)
(760) 747-5143 (Fax)
Professional information
Method For Creating And Preserving Alignment Marks For Aligning Mask Layers In Integrated Circuit Manufacture
US Patent:
6261918, Jul 17, 2001
Filed:
Oct 4, 1999
Appl. No.:
9/411807
Inventors:
Daniel M. So - Escondido CA
Assignee:
Conexant Systems, Inc. - Newport Beach CA
International Classification:
H01L 2176
US Classification:
438401
Abstract:
A method for creating and preserving alignment marks used for aligning mask layers in integrated circuit formation including the steps of creating a first set of marks within a reference layer to form a basic alignment mark, creating a second set of marks overlapping the first set of marks and positioned perpendicular to the first set of marks in the same reference layer to form a preservation pattern, and etching the reference layer to form a substantially checkerboard-type pattern where portions of the first set of marks are recessed within a thickness of the reference layer. After creating the checkerboard-type pattern formed from the first and second marks, a first metal a layer may be deposited to fill in any recesses contained within the pattern. CMP follows without damaging the segmented portions of the first set of marks which lie recessed within a thickness of the reference layer. Finally, the preserved portions of the first set of marks are aligned with pattern marks for a second metal layer.
Method For Encapsulating Microelectronic Devices
US Patent:
8513063, Aug 20, 2013
Filed:
Jun 26, 2012
Appl. No.:
13/533635
Inventors:
Michael J DeBar - Huntington Beach CA, US
David J Howard - Irvine CA, US
Daniel M. So - Escondido CA, US
David J Howard - Irvine CA, US
Daniel M. So - Escondido CA, US
Assignee:
Newport Fab, LLC - Newport Beach CA
International Classification:
H01L 21/44
US Classification:
438127, 438422, 257E21503
Abstract:
According to an embodiment disclosed herein, a microelectronic device to be encapsulated is built on, or alternatively in, a substrate. The device is then coated with a sacrificial layer. A lid layer is deposited over the sacrificial layer, and then appropriately perforated to optimize the removal of the sacrificial layer. The sacrificial layer is then removed using one of several etching or other processes. The perforations in the lid layer are then sealed using a viscous sealing material, thereby fixing the environment that encapsulates the device. The sealing material is then cured or hardened. An optional moisture barrier may be deposited over the cured sealing layer to provide further protection for the encapsulation if needed.
Structure For Encapsulating Microelectronic Devices
US Patent:
8212351, Jul 3, 2012
Filed:
Oct 2, 2006
Appl. No.:
11/542088
Inventors:
Michael J Debar - Huntington Beach CA, US
David J Howard - Irvine CA, US
Daniel M. So - Escondido CA, US
David J Howard - Irvine CA, US
Daniel M. So - Escondido CA, US
Assignee:
Newport Fab, LLC - Newport Beach CA
International Classification:
H01L 23/12
US Classification:
257704, 257787
Abstract:
According to an embodiment disclosed herein, a microelectronic device to be encapsulated is built on, or alternatively in, a substrate. The device is then coated with a sacrificial layer. A lid layer is deposited over the sacrificial layer, and then appropriately perforated to optimize the removal of the sacrificial layer. The sacrificial layer is then removed using one of several etching or other processes. The perforations in the lid layer are then sealed using a viscous sealing material, thereby fixing the environment that encapsulates the device. The sealing material is then cured or hardened. An optional moisture barrier may be deposited over the cured sealing layer to provide further protection for the encapsulation if needed.