Daniel Edward Siegfried
Engineers at Magnolia, Fort Collins, CO

2005004, Mar 3, 2005

Jul 21, 2004

10/896747

Daniel Siegfried - Fort Collins CO, US
David Burtner - Fort Collins CO, US
Scott Townsend - Fort Collins CO, US
John Keem - Bloomfield Hills MI, US
Mark Krivoruchko - Zelenograd, RU
Valery Alexeyey - Moscow, RU
Vsevolod Zelenkov - Moscow, RU

B03C003/00

096060000

A modular ion source design relies on relatively short modular anode layer source (ALS) components, which can be coupled together to form a longer ALS. For long ion sources, these shorter modular components allow for easier manufacturing and further result in a final assembly having better precision (e.g., a uniform gap dimensions along the longitudinal axis of the ion source). Modular components may be designed to have common characteristics so as to allow use of these components in ion sources of varying sizes. A modular gas distribution system uniformly distributes a working gas to the ionization region of the module ion source. For each gas distribution module, gas distribution channels and baffles are laid out relative to the module joints to prevent gas leakage. Furthermore, gas manifolds and supply channels are used to bridge module joints while uniformly distributing the working gas to the ALS.

7476869, Jan 13, 2009

Jan 12, 2007

11/622981

David M. Burtner - Belmont MA, US
Scott A. Townsend - Fort Collins CO, US
Daniel E. Siegfried - Fort Collins CO, US

Veeco Instruments, Inc. - Woodbury NY

H01J 49/10, H01J 37/08, H01J 7/24

250423R, 250424, 250426, 31511181, 31511191, 31511141, 3133621

A gas distributor is easily removable and replaceable in an ion source. The ion source has a removable anode assembly, including the gas distributor, that is separable and from a base assembly to allow for ease of servicing consumable components of the anode assembly. The gas distributor may be mounted to a thermal control plate in the anode assembly with several set screws. The gas distributor may be disk-shaped with counterbores in a surface to recess the heads of the set screws. Alternately, the gas distributor may be clamped or held in place by other structures or components of the ion source.

7439521, Oct 21, 2008

Jan 12, 2007

11/622949

David M. Burtner - Belmont MA, US
Scott A. Townsend - Fort Collins CO, US
Daniel E. Siegfried - Fort Collins CO, US

Veeco Instruments, Inc. - Fort Collins CO

H01J 7/24, H01J 49/10

250423R, 250424, 250426, 31511141, 31511181, 3133621

An ion source has a removable anode assembly that is separable and from a base assembly to allow for ease of servicing the consumable components of the anode assembly. Such consumables may include a gas distributor, a thermal control plate, an anode, and one or more thermal transfer sheets interposed between other components. A pole piece and a cathode may also be part of the anode assembly. The anode assembly may be attached to the base assembly via the pole piece.

7425711, Sep 16, 2008

Jan 12, 2007

11/622966

David M. Burtner - Belmont MA, US
Scott A. Townsend - Fort Collins CO, US
Daniel E. Siegfried - Fort Collins CO, US

Veeco Instruments, Inc. - Woodbury NY

H01J 7/24, H01J 49/10

250426, 250423 R, 250424, 31511141, 31511181, 3133621

A thermal control plate is easily removable and replaceable in an ion source. The ion source has a removable anode assembly, including the thermal control plate, that is separable and from a base assembly to allow for ease of servicing consumable components of the anode assembly. The thermal control plate may support a gas distributor and an anode in the anode assembly. The thermal control plate may have a port for passing working gas from one side of the thermal control plate to the other. An interface surface on the thermal control plate may have a pattern of recesses to allow the working gas to disperse underneath the gas distributor.

8374830, Feb 12, 2013

May 10, 2010

12/777034

Ikuya Kameyama - Fort Collins CO, US
Daniel E. Siegfried - Fort Collins CO, US

Veeco Instruments, Inc. - Woodbury NY

G06F 17/50, H01J 37/147

703 2, 703 7, 250396 R, 355 67, 716 50

A design process for varying hole locations or sizes or both in an ion beam grid includes identifying a control grid to be modified; obtaining a change factor for the grid pattern; and using the change factor to generate a new grid pattern. The change factor is one or both of a hole location change factor or a hole diameter change factor. Also included is an ion beam grid having the characteristic of hole locations or sizes or both defined by a change factor modification of control grid hole locations or sizes or both.

7342236, Mar 11, 2008

Feb 18, 2005

11/061254

David Matthew Burtner - Fort Collins CO, US
Scott A. Townsend - Fort Collins CO, US
Daniel E. Siegfried - Fort Collins CO, US
Viacheslav V. Zhurin - Fort Collins CO, US

Veeco Instruments, Inc. - Woodbury NY

H01J 7/24, H01J 49/10

250426, 250424, 250423 R, 31511141, 31511181, 3133621

An ion source is cooled using a cooling plate that is separate and independent of the anode. The cooling plate forms a coolant cavity through which a fluid coolant (e. g. , liquid or gas) can flow to cool the anode. In such configurations, the magnet may be thermally protected by the cooling plate. A thermally conductive material in a thermal transfer interface component can enhance the cooling capacity of the cooling plate. Furthermore, the separation of the cooling plate and the anode allows the cooling plate and cooling lines to be electrically isolated from the high voltage of the anode (e. g. , using a thermally conductive, electrically insulating material). Combining these structures into an anode subassembly and magnet subassembly can also facilitate assembly and maintenance of the ion source, particularly as the anode is free of coolant lines, which can present some difficulty during maintenance.

7718983, May 18, 2010

Aug 16, 2004

10/918865

David Matthew Burtner - Fort Collins CO, US
Daniel E. Siegfried - Fort Collins CO, US
Richard Blacker - Farmington Hills MI, US
Valery Alexeyev - Moscow, RU
John Keem - Bloomfield Hills MI, US
Vsevolod Zelenkov - Moscow, RU
Mark Krivoruchko - Zelenograd, RU

Veeco Instruments, Inc. - Plainview NY

G21F 5/00

2505151, 2504921, 25049221, 2504923, 2504931, 250423 R, 31511181

Shielding associated with an ion source, such as an anode layer source, reduces the amount and/or concentration of sputtered contaminants impinging and remaining on the surface of a target substrate. While passing the ion beam through to the target substrate, shielding can reduce the total amount of sputtered contaminants impinging the substrate before, during, and/or after passage of the substrate through the envelope of the etching beam. Particularly, a shield configuration that blocks the contaminants from impinging the substrate after the substrate passes through the etching beam (i. e. , outside of the envelope of the etching beam) yields a higher quality substrate with reduced substrate contamination.

6984942, Jan 10, 2006

Jul 21, 2004

10/896745

Daniel E. Siegfried - Fort Collins CO, US
David Matthew Burtner - Fort Collins CO, US
Scott A. Townsend - Fort Collins CO, US
John Keem - Bloomfield Hills MI, US
Valery Alexeyev - Moscow, RU
Vsevolod Zelenkov - Moscow, RU
Mark Krivoruchko - Zelenograd, RU

Veeco Instruments, Inc. - Woodbury NY

H01J 7/24

31511181, 250423 R

An ion source design and manufacturing techniques allows longitudinal cathode expansion along the length of the anode layer source (ALS). Cathode covers are used to secure the cathode plates to the source body assembly of an ion source. The cathode covers allow the cathode plate to expand along the longitudinal axis of the ion source, thereby relieving the stress introduced by differential thermal expansion. In addition, the cathode cover configuration allows for less expensive cathode plates, including modular cathode plates. Such plates can be adjusted relative to the cathode-cathode gap to prolong the life of a given cathode plate and maintain source performance requirements. A cathode plate in a linear section of an ion source has symmetrical edges and can, therefore, be flipped over to exchange the first (worn) cathode edge with the second (unworn) cathode edge.

7716021, May 11, 2010

Mar 31, 2006

11/395354

Ikuya Kameyama - Fort Collins CO, US
Daniel E. Siegfried - Fort Collins CO, US

Veeco Instruments, Inc. - Woodbury NY

G06F 17/50

703 2, 703 7, 716 21, 355 67

A design process for varying hole locations or sizes or both in an ion beam grid includes identifying a control grid to be modified; obtaining a change factor for the grid pattern; and using the change factor to generate a new grid pattern. The change factor is one or both of a hole location change factor or a hole diameter change factor. Also included is an ion beam grid having the characteristic of hole locations or sizes or both defined by a change factor modification of control grid hole locations or sizes or both.

7425709, Sep 16, 2008

Jul 21, 2004

10/896746

Daniel E. Siegfried - Fort Collins CO, US
David Matthew Burtner - Fort Collins CO, US
Scott A. Townsend - Fort Collins CO, US
Valery Alexeyev - Moscow, RU

Veeco Instruments, Inc. - Woodbury NY

H01J 27/00

250423R, 31511181, 31511191, 250423 F, 250424, 250426

A modular ion source design relies on relatively short modular core ALS components, which can be coupled together to form a longer ALS while maintaining an acceptable tolerance of the anode-cathode gap. Many of the modular components may be designed to have common characteristics so as to allow use of these components in ion sources of varying sizes. A flexible anode can adapt to inconsistencies in the ion source body and module joints to hold a uniform anode-cathode gap along the length of the ALS. A clamp configuration fixes the cooling tube to the ion source body, thereby avoiding heat-introduced warping to the source body during manufacturing.