CRAIG STEPHEN AMRINE, L.AC.
Acupuncture at Baseline Rd, Tempe, AZ

7405102, Jul 29, 2008

Jun 9, 2006

11/450667

Tien Yu T. Lee - Phoenix AZ, US
Craig S. Amrine - Tempe AZ, US
Victor A. Chiriac - Phoenix AZ, US
Lizabeth Ann Keser - Chandler AZ, US
George R. Leal - Cedar Park TX, US
Robert J. Wenzel - Austin TX, US

Freescale Semiconductor, Inc. - Austin TX

H01L 21/00

438106, 438127

A multi-layer structure () includes a first build-up layer structure () configured to connect to a heat-generating module (), a second build-up layer structure () configured to connect to a substrate, and a middle layer () provided between the first build-up layer structure and the second build-up layer structure, the middle layer including at least one semiconductor component () and a heat spreader (). A first set of thermal vias () extend through the first build-up layer structure to the heat spreader, and a second set of thermal vias ( extend through the second build-up layer structure to the heat spreader, wherein at least a portion of the first set of thermal vias is in thermal contact with the heat-generating module.

5894193, Apr 13, 1999

Mar 5, 1997

8/811653

Craig Amrine - Tempe AZ
Clifford L. Anderson - Tempe AZ
Ronald O. Petersen - Phoenix AZ

Motorola Inc. - Schaumburg IL

H01J 130, H01J 188, H01J 718

313495

A field emission display (400) includes a cathode plate (410), an anode plate (430), and a mechanical support/getter assembly (300) being disposed between the cathode plate (410) and the anode plate (430). The mechanical support/getter assembly (300) includes a unitary spacer-frame assembly (310) made from a photosensitive glass. A method for fabricating the mechanical support/getter assembly (300) includes the steps of: selectively exposing inter-spacer regions (110) and a getter frame region (120) of a layer (100) of the photosensitive glass to UV radiation, heating the layer (100) to crystallize the UV-exposed regions, and removing the crystallized inter-spacer regions (110) and partially removing the crystallized getter frame regions by contacting the layer (100) with an acid, thereby forming spacer ribs (314) and a getter land (322). The method further includes providing a getter frame (320) on the spacer land (322).

7442581, Oct 28, 2008

Dec 10, 2004

11/009284

William H. Lytle - Chandler AZ, US
Craig S. Amrine - Tempe AZ, US

Freescale Semiconductor, Inc. - Austin TX

H01L 21/00

438118, 438127

Methods and apparatus are provided for use in manufacturing a device packaging comprising the steps of: positioning a metal substrate such as spring steel on a magnetic plate so as to expose a surface of the metal substrate; placing a first tape layer on the exposed surface of a metal substrate so as to expose a nonstick surface of the first tape layer such as PTFE; placing a second tape layer on the exposed surface of the first tape layer so as to expose a surface of the second tape layer; positioning a mold frame on the exposed surface of the second tape layer; positioning a die within the mold frame; depositing epoxy within the mold frame; curing the epoxy so as to create a molded panel; removing the mold frame; grinding the molded panel to a desired thickness; separating the first tape layer from the second tape layer so as to separate the metal substrate from the molded panel; and peeling the second tape layer from the molded panel. The process provides an efficient method for creating a chips first package.

6114802, Sep 5, 2000

Feb 28, 1997

8/808382

Craig Amrine - Tempe AZ
Kenneth Dean - Phoenix AZ
Curtis D. Moyer - Phoenix AZ

Motorola, Inc. - Schaumburg IL

H01J 1924, H01J 2904

313309

A field emission device (400) includes a plastically-deformable, ceramic, stamped substrate (200) made from a plastically deformable ceramic, which in the preferred embodiment includes a calendered tape. The plastically-deformable, ceramic, stamped substrate (200) includes first and second opposed surfaces (202, 204) and defines apertures (206) in which are formed extraction electrodes (410). The field emission device (400) further includes an electron-emissive layer (418) being formed on the first opposed surface (202). Cathodes (420) are disposed on the electron-emissive layer (418) and cross the extraction electrodes (410) at an angle of 90. degree. A method for fabricating said field emission device (400) includes stamping a layer (100) of the softened calendered tape with a die (300) to define the apertures (206) and grooves (208, 212, 214).

7802359, Sep 28, 2010

Dec 27, 2007

11/965519

William H. Lytle - Chandler AZ, US
Craig S. Amrine - Tempe AZ, US

Freescale Semiconductor, Inc. - Austin TX

H05K 3/36

29830, 29825, 29832, 156584, 269903

A method is described for manufacturing electronic assemblies (). Electronic die () held in a plastic matrix () form a partially completed panel () of electronic assemblies (). The panel () is adhesively mounted to a ceramic carrier () having multiple holes () there through. Conductive interconnects (-- etc. ) and other layers are applied to the panel, coupled to electrical contacts on the die () and external electrical contacts (-) for the panel (). The panel () and the carrier () are separated and the panel singulated to release the finished electronic assemblies (). Silicone is a preferred adhesive () and is dissolved using a non-polar solvent () that penetrates through the holes () in the carrier () to the adhesive (). The adhesive () is preferentially applied using a transfer adhesive sandwich (), that is, an adhesive layer () with removable plastic sheets () on either side that can be peeled away from the adhesive (). This facilitates handling and properly locating the adhesive () on the carrier () for efficient low cost manufacture of the assemblies ().

2011021, Sep 8, 2011

Oct 23, 2008

13/125502

Wei Gao - Tianjin, CN
Craig S. Amrine - Tempe AZ, US
Zhiwei Gong - Tianjin, CN
Scott M. Hayes - Chandler AZ, US
Lizabeth Ann Keser - Chandler AZ, US
George R. Leal - Cedar Park TX, US
William H. Lytle - Chandler AZ, US

FREESCALE SEMICONDUCTOR, INC. - TX30/OE62 TX

H01L 21/78

438113, 257E21599

Methods for forming electronic assemblies are provided. A device substrate having a plurality of electronic components embedded therein is provided. The device substrate is attached to a carrier substrate using an adhesive material. A plurality of cuts are formed through the device substrate to divide the device substrate into a plurality of portions. Each of the plurality of portions includes at least one of the electronic components. A force is applied to each of the plurality of portions in a direction away from the carrier substrate to remove the plurality of portions from the carrier substrate.

5990613, Nov 23, 1999

Jan 20, 1998

9/009097

Scott K. Ageno - Phoenix AZ
Peter A. Smith - Chandler AZ
Rong-Fong Huang - Albuquerque NM
Joyce K. Yamamoto - Albuquerque NM
Craig Amrine - Tempe AZ

Motorola, Inc. - Schaummburg IL

H01J 1942, H01J 2918, H01J 162

313495

A field emission display (100) includes a cathode plate (102) having a plurality of electron emitters (124), an anode plate (104) opposing the cathode plate (102), and a bulk-resistive spacer (108) extending between the anode plate (104) and the cathode plate (102). The bulk-resistive spacer (108) is made from an electrically conductive material. The resistivity of the electrically conductive material is selected to remove impinging charges while preventing excessive power loss due to electrical current through the bulk-resistive spacer (108) from the anode plate (104) to the cathode plate (102).

7741151, Jun 22, 2010

Nov 6, 2008

12/266406

Craig S. Amrine - Tempe AZ, US
William H. Lytle - Chandler AZ, US

Freescale Semiconductor, Inc. - Austin TX

H01L 21/00

438107, 438113, 438118, 438612, 438613, 257E21499, 257E21503, 257E23001, 257E23067, 257E23171, 257E23172, 257E25011, 257E25012

Integrated circuit packages are formed from a panel where the panel is separated by laser cutting the panel. In some embodiments, the panel is attached to the carrier for the formation of interconnect layers on the panel. Afterwards, the panel is cut with a laser while on the carrier to separate the integrated circuit packages. A tape or other type of structure may be attached to the top of the packages after the laser cutting. The integrated circuit packages are removed from the carrier by releasing the adhesive and removing the integrated circuit packages with the tape. The packages are then removed from the tape.

5717287, Feb 10, 1998

Aug 2, 1996

8/691739

Craig Amrine - Tempe AZ
Kenneth Dean - Phoenix AZ

Motorola - Schaumburg IL

H01J 3100

313495

A method for affixing a plurality of spacers (150, 250) within a field emission display (100, 200) is disclosed. The method includes the steps of: (i) forming a metallic bonding pad (160, 260) on the inner surface of the anode (110) or cathode (230) (ii) placing an edge of the spacers (150, 250) in intimate physical contact with a portion of the metallic bonding pad (160, 260) thereby providing contacting surfaces (iii) applying a potential difference of about 1000 Volts across the contacting surfaces so that the metallic bonding pad (160, 260) is biased positively with respect to the spacers (150, 250), and (iv) simultaneously heating the region about, and including, the bonding surfaces to a temperature of about 400 degrees Celsius for about 15 minutes so that an anodic bond is formed between the contacting surfaces.