DR. CHRISTOPHER M JAMES, DMD
Dentist at Boardwalk, San Marcos, CA

4598308, Jul 1, 1986

Apr 2, 1984

6/596053

Christopher D. James - La Costa CA
Norman E. McNeal - Carlsbad CA

Burroughs Corporation - Detroit MI

H01L 2340, H01L 2350

357 81

An assembly of intercoupled integrated circuit die comprises: a substrate having a plurality of holes which extend through the substrate; each hole is of a size that is suitable to receive an integrated circuit die; a plurality of independent subassemblies are also provided; each subassembly includes an integrated circuit die and a heat sink which is attached to the back of the die and extends beyond it; each subassembly is aligned with a respective hole in the substrate such that the die lies in the hole and the heat sink extends beyond the hole and attaches to the substrate; subassemblies are interconnected by printed conductors on the substrate and discrete wires that are bonded from the front of the die to the conductors; and the die and heat sink have similar thermal expansion coefficients, while the substrate has a substantially different thermal expansion coefficient.

5620933, Apr 15, 1997

May 19, 1995

8/445139

Christopher D. James - Carlsbad CA
Henry S. Katzenstein - Arroyo Grande CA

Brooktree Corporation - San Diego CA

H01L 21461, H01L 21465

216 2

A bridging member extending across a cavity in a semiconductor substrate (e. g. single crystal silicon) has successive layers--a masking layer, an electrically conductive layer (e. g. polysilicon) and an insulating layer (e. g. SiO. sub. 2). A first electrical contact (e. g. gold coated with ruthenium) extends on the insulating layer in a direction perpendicular to the extension of the bridging member across the cavity. A pair of bumps (e. g. gold) are on the insulating layer each between the contact and one of the cavity ends. Initially the bridging member and then the contact and the bumps are formed on the substrate and then the cavity is etched in the substrate through holes in the bridging member. A pair of second electrical contacts (e. g. gold coated with ruthenium) are on the surface of an insulating substrate (e. g.

5479042, Dec 26, 1995

Feb 1, 1903

8/012055

Christopher D. James - Carlsbad CA
Henry S. Katzenstein - Arroyo Grande CA

Brooktree Corporation - San Diego CA

H01L 2966, H01L 2996

257415

A bridging member extending across a cavity in a semiconductor substrate (e. g. single crystal silicon) has successive layers--a masking layer, an electrically conductive layer (e. g. polysilicon) and an insulating layer (e. g. SiO. sub. 2). A first electrical contact (e. g. gold coated with ruthenium) extends on the insulating layer in a direction perpendicular to the extension of the bridging member across the cavity. A pair of bumps (e. g. gold) are on the insulating layer each between the contact and one of the cavity ends. Initially the bridging member and then the contact and the bumps are formed on the substrate and then the cavity is etched in the substrate through holes in the bridging member. A pair of second electrical contacts (e. g. gold coated with ruthenium) are on the surface of an insulating substrate (e. g.

5627396, May 6, 1997

May 18, 1995

8/443456

Christopher D. James - Carlsbad CA
Henry S. Katzenstein - Arroyo Grande CA

Brooktree Corporation - San Diego CA

H01L 2982

257415

A bridging member extending across a cavity in a semiconductor substrate (e. g. signal crystal silicon) has successive layers--a masking layer, an electrically conductive layer (e. g. polysilicon) and an insulating layer (e. g. SiO. sub. 2). A first electrical contact (e. g. gold coated with ruthenium) extends on the insulating layer in a direction perpendicular to the extension of the bridging member across the cavity. A pair of bumps (e. g. gold) are on the insulating layer each between the contact and one of the cavity ends. Initially the bridging member and then the contact and the bumps are formed on the substrate and then the cavity is etched in the substrate through holes in the bridging member. A pair of second electrical contacts (e. g. gold coated with ruthenium) are on the surface of an insulating substrate (e. g.