Inventors:
Sankar K. Paul - Bradford CT, US
Christopher J. Caisse - Danielson CT, US
Dirk M. Baars - South Windsor CT, US
Assignee:
WORLD PROPERTIES, INC. - Lincolnwood IL
International Classification:
B32B 5/16, B32B 3/10, B32B 37/00
Abstract:
A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.