MR. CHRISTOPHER JOHN GORDON CHISHOLM, M.D.
Psychiatric at Pomerado Rd, Poway, CA
License number
California A86646
Category
Psychiatric
Type
Pain Medicine
License number
California A86646
Category
Psychiatric
Type
Interventional Pain Medicine
Address
Address
2
15725 Pomerado Rd SUITE 107, Poway, CA 92064
PO Box 969096, San Diego, CA 92196
PO Box 969096, San Diego, CA 92196
Phone
(858) 453-7700
(858) 947-3828 (Fax)
(858) 495-0971
(858) 947-3828 (Fax)
(858) 495-0971
Professional information
Christopher Gordon, San Diego CA
Specialties:
Family Medicine
Work:
Christopher J Keys
823 Gateway Center Way, San Diego, CA 92102
823 Gateway Center Way, San Diego, CA 92102
Education:
Texas A&M University(2002)
Christopher Gordon, San Diego CA
Specialties:
Family Physician
Address:
823 Gateway Center Way, San Diego, CA 92102
1111 W Chase Ave, El Cajon, CA 92020
1111 W Chase Ave, El Cajon, CA 92020
Impedence Matching Along Verticle Path Of Microwave Vias In Multilayer Packages
US Patent:
7053729, May 30, 2006
Filed:
Aug 23, 2004
Appl. No.:
10/925377
Inventors:
Gerardo Aguirre - San Diego CA, US
Christopher Gordon - San Diego CA, US
Christopher Gordon - San Diego CA, US
Assignee:
Kyocera America, Inc. - San Diego CA
International Classification:
H01P 3/08, H05K 1/18
US Classification:
333 33, 333246, 174262
Abstract:
High frequency matching in a multilayer ceramic package is accomplished by a radial stub arrangement provided in one or more of the ground planes of a stack of layers forming the package. A signal via extends vertically upwardly between a ball grid array at a bottom surface of the stack and a coplanar waveguide in the form of a signal trace on a top surface of the stack. Each radial stub arrangement surrounds the signal via and is formed by a central space in the ground plane which surrounds the via and a plurality of stub-forming spaces in the ground plane which extend radially outwardly from the central space. The stub-forming spaces form a plurality of radial stubs which extends inwardly from the ground plane to locations adjacent but spaced apart from the signal via. The discontinuities provided by the spaces behave as a shunt inductance connected to a series capacitance. The radial stub arrangements provide high frequency matching in an arrangement which is confined to the vertical path of the signal via, thereby enabling higher interconnect density in multilayer packages.