Christopher Daniel Young
Medical Practice in Newark, DE
License number
Delaware C7-0004307
Issued Date
May 27, 2009
Expiration Date
Mar 31, 2015
Category
Medical Practice
Type
ACGME Training
Address
Address
2
Newark, DE 19718
Professional information
Dr. Christopher D Young, Newark DE - DO (Doctor of Osteopathic Medicine)
Specialties:
General Surgery
Address:
CHRISTIANA CARE HEALTH SYSTEM
4745 Ogletown Stanton Rd, Newark 19713
(302) 733-4503 (Phone), (302) 733-4513 (Fax)
4745 Ogletown Stanton Rd, Newark 19713
(302) 733-4503 (Phone), (302) 733-4513 (Fax)
Languages:
English
Hospitals:
CHRISTIANA CARE HEALTH SYSTEM
4745 Ogletown Stanton Rd, Newark 19713
Christiana Care Health System - Christiana Hospital
4755 Ogletown Stanton Rd, Newark 19718
4745 Ogletown Stanton Rd, Newark 19713
Christiana Care Health System - Christiana Hospital
4755 Ogletown Stanton Rd, Newark 19718
Method Of Manufacturing Chemical Mechanical Polishing Layers Having A Window
US Patent:
2013024, Sep 26, 2013
Filed:
Mar 22, 2012
Appl. No.:
13/427408
Inventors:
Brian T. Cantrell - Port Deposit MD, US
Kathleen McHugh - Newark DE, US
James T. Murnane - Norristown PA, US
George H. McClain - Middletown DE, US
Durron A. Hutt - Wilmington DE, US
Robert A. Brady - Coatesville PA, US
Christopher A. Young - Newark DE, US
Jeffrey Borcherdt Miller - West Chester PA, US
Kathleen McHugh - Newark DE, US
James T. Murnane - Norristown PA, US
George H. McClain - Middletown DE, US
Durron A. Hutt - Wilmington DE, US
Robert A. Brady - Coatesville PA, US
Christopher A. Young - Newark DE, US
Jeffrey Borcherdt Miller - West Chester PA, US
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE
International Classification:
B24D 11/00
US Classification:
51298
Abstract:
A method of manufacturing polishing layers having a window for use in chemical mechanical polishing pads is provided, wherein a plurality of polishing layers having an integral window are derived from a cake, wherein the formation of density defects in the cake and the surface roughness of the polishing layers formed are minimized.
Method Of Manufacturing Chemical Mechanical Polishing Layers
US Patent:
2013024, Sep 26, 2013
Filed:
Mar 22, 2012
Appl. No.:
13/427383
Inventors:
Brian T. Cantrell - Port Deposit MD, US
Kathleen McHugh - Newark DE, US
James T. Murnane - Norristown PA, US
George H. McClain - Middletown DE, US
Durron A. Hutt - Wilmington DE, US
Robert A. Brady - Coatesville PA, US
Christopher A. Young - Newark DE, US
Jeffrey Borcherdt Miller - West Chester PA, US
Kathleen McHugh - Newark DE, US
James T. Murnane - Norristown PA, US
George H. McClain - Middletown DE, US
Durron A. Hutt - Wilmington DE, US
Robert A. Brady - Coatesville PA, US
Christopher A. Young - Newark DE, US
Jeffrey Borcherdt Miller - West Chester PA, US
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE
International Classification:
B24D 11/00
US Classification:
51298
Abstract:
A method of manufacturing polishing layers for use in chemical mechanical polishing pads is provided, wherein a plurality of polishing layers are derived from a cake, wherein the formation of density defects in the cake and the surface roughness of the polishing layers formed are minimized.
Method Of Manufacturing Chemical Mechanical Polishing Layers
US Patent:
8444727, May 21, 2013
Filed:
Aug 16, 2011
Appl. No.:
13/210432
Inventors:
Kathleen McHugh - Newark DE, US
James T. Murnane - Conshohocken PA, US
George Harry McClain - Middletown DE, US
Durron Andre Hutt - Wilmington DE, US
Robert A Brady - Coatesville PA, US
Christopher Alan Young - Newark DE, US
Jeffrey Borcherdt Miller - West Chester PA, US
James T. Murnane - Conshohocken PA, US
George Harry McClain - Middletown DE, US
Durron Andre Hutt - Wilmington DE, US
Robert A Brady - Coatesville PA, US
Christopher Alan Young - Newark DE, US
Jeffrey Borcherdt Miller - West Chester PA, US
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE
International Classification:
C09K 3/14
US Classification:
51298, 51293, 425130
Abstract:
A method of manufacturing polishing layers for use in chemical mechanical polishing pads is provided, wherein the formation of density defects in the polishing layers is minimized.