CHRISTOPHER BREWER SANDERS
Pilots at Hawk Holw Ln, Wake Forest, NC
License number
North Carolina A4116347
Issued Date
Jan 2016
Expiration Date
Jan 2018
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
1116 Hawk Hollow Ln, Wake Forest, NC 27587
Personal information
See more information about CHRISTOPHER BREWER SANDERS at radaris.comName
Address
Phone
4702 Walden Pond Dr APT B, Raleigh, NC 27604
565 Military Cutoff Rd TRLR 3, Wilmington, NC 28405
5558 Walnut Park Ln, Winston Salem, NC 27106
3615 Dewsbury Rd, Winston Salem, NC 27104
3684 10 Mile Fork Rd, Trenton, NC 28585
Professional information
See more information about CHRISTOPHER BREWER SANDERS at trustoria.com
Micromachined Ultrasonic Transducer With Air-Backed Cavity And Electrical Connection
Micromachined Ultrasonic Transducer With Air-Backed Cavity And Electrical Connection
US Patent:
8624469, Jan 7, 2014
Filed:
Apr 22, 2011
Appl. No.:
13/643649
Inventors:
David Dausch - Raleigh NC, US
Jim Carlson - Durham NC, US
Christopher Brewer Sanders - Wake Forest NC, US
Scott H. Goodwin - Chapel Hill NC, US
Jim Carlson - Durham NC, US
Christopher Brewer Sanders - Wake Forest NC, US
Scott H. Goodwin - Chapel Hill NC, US
Assignee:
Research Triangle Institute - Research Triangle Park NC
International Classification:
H01L 41/08, A61B 8/00
US Classification:
310334, 600437, 600459
Abstract:
A method and associated apparatus directed to a piezoelectric micromachined ultrasonic transducer (pMUT) defining an air-backed cavity are provided. A first via defined by a device substrate and associated dielectric layer, and extending to the first electrode, is substantially filled with a first conductive material. A support member engaged with the device substrate defines a second via extending to the first conductive material. The second via has a second conductive material disposed thereon, forms an electrically-conductive engagement with the first conductive material, and extends outwardly of the second via to be accessible externally to the support member. A connective element extends through a third via defined by a connection support substrate and is in electrically-conductive engagement with the second conductive material, wherein one of the connective element and connection support substrate is bonded to one of the support member and second conductive material by a bonding material engaged therebetween.