Charles Don Martin
Engineers at Medinah Dr, Mckinney, TX
License number
Colorado 33135
Issued Date
Oct 23, 1998
Renew Date
Nov 1, 2013
Expiration Date
Oct 31, 2015
Type
Professional Engineer
Address
Address
902 Medinah Dr, Mckinney, TX 75069
Professional information
Fine Pitch System And Method For Reinforcing Bond Pads In Semiconductor Devices
US Patent:
6448650, Sep 10, 2002
Filed:
May 14, 1999
Appl. No.:
09/312385
Inventors:
Mukul Saran - Richardson TX
Charles A. Martin - Melissa TX
Ronald H. Cox - Plano TX
Charles A. Martin - Melissa TX
Ronald H. Cox - Plano TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 2352
US Classification:
257758, 257750, 257763, 257786, 257773, 257774, 257775
Abstract:
A reinforcing system and method of fabrication for a semiconductor integrated circuit bond pad comprises a first dielectric layer or stack disposed under the bond pad; at least one second dielectric layer or stack disposed under the first dielectric layer; and a reinforcing metal structure disposed into the second dielectric layer such that the patterns of the metal structure and the second dielectric layer comprise a uniformly flat interface towards the first dielectric layer. The patterns of the metal structure and the second dielectric layer comprise feature sizes and fine pitches used in the integrated circuit.
System And Method For Reinforcing A Bond Pad
US Patent:
6625882, Sep 30, 2003
Filed:
Feb 11, 1999
Appl. No.:
09/248303
Inventors:
Mukul Saran - Richardson TX
Charles A. Martin - McKinney TX
Charles A. Martin - McKinney TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01R 900
US Classification:
29843, 29846, 29840, 22818021, 22818022
Abstract:
A reinforcing system for a bond which includes at least one dielectric layer or stack disposed under the bond pad. A reinforcing patterned structure is disposed in the dielectric layer or stack with the delectric filling the portion of the patterned structure from which the structure was removed after patterning.
Fine Pitch System And Method For Reinforcing Bond Pads In Semiconductor Devices
US Patent:
6818540, Nov 16, 2004
Filed:
Jul 23, 2002
Appl. No.:
10/201725
Inventors:
Mukul Saran - Richardson TX
Charles A. Martin - Melissa TX
Ronald H. Cox - Plano TX
Charles A. Martin - Melissa TX
Ronald H. Cox - Plano TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 2144
US Classification:
438612, 438622, 438623, 438637
Abstract:
A reinforcing system and method of fabrication for a semiconductor integrated circuit bond pad comprises a first dielectric layer or stack disposed under the bond pad; at least one second dielectric layer or stack disposed under the first dielectric layer; and a reinforcing metal structure disposed into the second dielectric layer such that the patterns of the metal structure and the second dielectric layer comprise a uniformly flat interface towards the first dielectric layer. The patterns of the metal structure and the second dielectric layer comprise feature sizes and fine pitches used in the integrated circuit.
System And Method For Reinforcing A Bond Pad
US Patent:
6143396, Nov 7, 2000
Filed:
Apr 30, 1997
Appl. No.:
8/847239
Inventors:
Mukul Saran - Richardson TX
Charles A. Martin - McKinney TX
Charles A. Martin - McKinney TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 2352
US Classification:
428162
Abstract:
The reinforcing system (10, 70, 90) for a bond pad (12, 72, 92) includes at least one dielectric layer or stack (20, 21, 22, 76, 78, 96, 98) disposed under the bond pad (12, 72, 92). A reinforcing patterned structure (30, 80, 82, 100, 102) is disposed in the dielectric layer or stack (20, 21, 22, 76, 78, 96, 98).
Contact Mechanism Cleaning
US Patent:
7474089, Jan 6, 2009
Filed:
Dec 28, 2006
Appl. No.:
11/646936
Inventors:
Byron Harry Gibbs - McKinney TX, US
Charles Allen Martin - Melissa TX, US
Charles Allen Martin - Melissa TX, US
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
G01R 31/02
US Classification:
3241581, 324 731, 324757
Abstract:
One embodiment of the present invention includes a method for reactively cleaning a contact mechanism. The method includes measuring contact resistance (CRES) associated with a plurality of electrical contacts of the contact mechanism. The method also includes generating at least one statistic of the measured CRES associated with the plurality of electrical contacts of the contact mechanism, and comparing the at least one statistic of the CRES associated with the plurality of electrical contacts of the contact mechanism with at least one CRES threshold parameter associated with an unacceptable level of CRES. The method further includes cleaning the plurality of electrical contacts of the contact mechanism based on the comparison of the at least one statistic of the CRES and the at least one CRES threshold parameter.