Inventors:
Thomas S. Lincoln - Arvada CO
Charles E. Bauer - Evergreen CO
Assignee:
Microlithics Corporation - Golden CO
International Classification:
C23C 2600
Abstract:
A method of boring holes in a circuit board assembly of the type having a first layer of material which is primarily reflective of light of a first light wavelength and having a second layer of material, overlying the first layer of material, which is primarily absorptive of light of the first light wavelength, comprising: tuning the frequency of a laser cutting device to the first light wavelength; directing a laser beam from the tuned laser cutting device onto the second layer of material in a region where a hole is to be provided; and terminating application of the laser beam after a hole has been bored through the second layer of material.