Inventors:
Nicholas Amoroso - Elgin IL, US
Bruno Tolla - Naperville IL, US
David Boldridge - Oswego IL, US
International Classification:
C09G 1/02, C09K 13/00, B01D 61/14, B01D 15/04, C09K 3/14, B01D 36/00
US Classification:
51308, 51309, 2101952, 210 85, 252 791
Abstract:
The present invention provides a system and method for recycling an abrasive chemical mechanical polishing (CMP) slurry after polishing substrates therewith. The method comprises circulating the recovered CMP slurry from a blending tank through an ultrafiltration unit and back into the, the ultrafiltration unit removing a predetermined amount of water from recovered slurry to form a slurry concentrate; optionally adjusting the pH of the concentrate to a predetermined target level; and optionally adding selected additive chemical components and/or water to the concentrate in amounts sufficient to form a reconstituted CMP slurry that is suitable for use in a CMP process.