BRUNO NARDELLI
Broker in Watertown, MA
License number
Massachusetts 81083
Issued Date
Apr 1, 1986
Expiration Date
Nov 21, 2018
Type
Salesperson
Address
Address
Watertown, MA 02472
Professional information
Micro-Gap Thermal Photovoltaic Large Scale Sub-Micron Gap Method And Apparatus
US Patent:
2011031, Dec 29, 2011
Filed:
Feb 28, 2011
Appl. No.:
13/037214
Inventors:
Eric L. Brown - Cambridge MA, US
Robert S. DiMatteo - Cambridge MA, US
Bruno A. Nardelli - Watertown MA, US
Bin Peng - Wuhan, CN
Xiao Li - Wuhan, CN
Robert S. DiMatteo - Cambridge MA, US
Bruno A. Nardelli - Watertown MA, US
Bin Peng - Wuhan, CN
Xiao Li - Wuhan, CN
Assignee:
MTPV Corporation - Austin TX
International Classification:
H01L 31/052
US Classification:
136246
Abstract:
The present invention relates to micron-gap thermal photovoltaic (MTPV) technology for the solid-state conversion of heat to electricity. The problem is forming and then maintaining the close spacing between two bodies at a sub-micron gap in order to maintain enhanced performance. While it is possible to obtain the sub-micron gap spacing, the thermal effects on the hot and cold surfaces induce cupping, warping, or deformation of the elements resulting in variations in gap spacing thereby resulting in uncontrollable variances in the power output. A major aspect of the design is to allow for intimate contact of the emitter chips to the shell inside surface, so that there is good heat transfer. The photovoltaic cells are pushed outward against the emitter chips in order to press them against the inner wall. A high temperature thermal interface material improves the heat transfer between the shell inner surface and the emitter chip.
Multi-Component Board Assembly
US Patent:
2003006, Apr 3, 2003
Filed:
Oct 2, 2001
Appl. No.:
09/970115
Inventors:
Bruno Nardelli - Watertown MA, US
Mark Lucas - Chelmsford MA, US
Jeffery Bean - Fitchburg MA, US
Mark Lucas - Chelmsford MA, US
Jeffery Bean - Fitchburg MA, US
International Classification:
G02B006/36, G02B006/26
US Classification:
385/053000, 385/015000, 385/147000
Abstract:
An apparatus and method for assembling and interconnecting stacked optoelectronic circuit boards is described. The circuit boards are rotatably attached using a mechanism such as a hinge. Transmission lines such as optical fibers interconnecting the boards are guided parallel to or on the rotational axis of the attachment for a portion of their length. Bending stress on fiber optic interconnects due to relative motion of the circuit boards is minimized. Signals can be transmitted between the boards at any angle within a rotational range about the axis. This enhances access to components on stacked circuit boards and allows service procedures to be carried out efficiently.