Inventors:
Fred H. Ives - Veradale WA, US
Dean Nicholson - Windsor CA, US
Jonathan Storie - Santa Rosa CA, US
Brian Carlson - Spokane WA, US
Assignee:
Agilent Technologies, Inc. - Santa Clara CA
International Classification:
H01L 29/267
US Classification:
257 82, 257100, 257433, 257724, 257E25032
Abstract:
By adding light reflective and/or transparent and/or translucent material within a micro-electronic circuit housing, improved light transfer is achieved between a light generation source and a light utilization device. In one embodiment, the reflective material is placed on the inside surface of a non-metallic housing lid and the light from the light source (typically an LED) reflects from the reflective material and impacts the device (typically an FET). In another embodiment, the LED and FET are encased in a clear (low light-loss) material (typically silicone overcoat) so as to allow the light from the LED to reflect from the top of the clear material onto the FET. If desired, an opaque encapsulant surrounds the clear material and fills out the volume within the housing. In another embodiment, clear or translucent (as opposed to opaque) encapsulant can be used to serve dual purpose as both the structural (volume filling, defined package share/outline) agent as well as to permit the internal light transmission and reflections to illuminate the device.