BRIAN M SMITH
Broker in Mansfield, MA
License number
Massachusetts 9002335
Issued Date
Mar 31, 1993
Expiration Date
Jan 29, 1996
Type
Salesperson
Address
Address
Mansfield, MA 02048
Professional information
High Density Chip Socket
US Patent:
4620761, Nov 4, 1986
Filed:
Jan 30, 1985
Appl. No.:
6/696663
Inventors:
Brian M. Smith - Mansfield MA
Emanuel D. Torti - Boston MA
Emanuel D. Torti - Boston MA
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01R 909
US Classification:
339 75MP
Abstract:
An interconnection system for high density I/O sites on an I. C. Interconnection substrate allowing field replacement thereof has a socket body with an array of contact springs adapted to be removably biased into engagement with conductive pads on the bottom surface of the substrate. The contact springs have a tail portion depending from the socket body which are affixed to a printed board. The substrate is locked into place on the socket body by removable latches.