BRIAN K LEE
Cosmetology in New York, NY

License number
Pennsylvania CO225011L
Category
Cosmetology
Type
Cosmetologist
Address
Address 2
New York, NY 10029
Pennsylvania

Personal information

See more information about BRIAN K LEE at radaris.com
Name
Address
Phone
Brian Brian Lee, age 39
320 Glen Cove Rd, Glen Head, NY 11545
(203) 250-1443
Brian Brian Lee, age 45
47 Windsor Gate Dr, North Hills, NY 11040
Brian Brian Lee, age 67
4826 Lima Rd, Geneseo, NY 14454
(585) 335-9446
Brian Brian Lee, age 50
48 Farrel St, New Hyde Park, NY 11040
(516) 746-0921
Brian Brian Lee, age 54
4 Log Cabin Ct, Altoona, PA 16602

Professional information

See more information about BRIAN K LEE at trustoria.com
Brian Lee Photo 1
Executive Director - Worldwide Planning - Supply Chain Operations At Viacom Inc - Paramount Pictures Inc

Executive Director - Worldwide Planning - Supply Chain Operations At Viacom Inc - Paramount Pictures Inc

Position:
Executive Director - Worldwide Planning - Supply Chain Operations at Viacom Inc - Paramount Pictures Home Entertainment Inc
Location:
Greater New York City Area
Industry:
Consumer Goods
Work:
Viacom Inc - Paramount Pictures Home Entertainment Inc since May 2008 - Executive Director - Worldwide Planning - Supply Chain Operations Time Warner Inc - Warner Brothers Entertainment Inc Oct 2005 - May 2008 - Director - Distribution Operations, Manufacturing and Reporting Herbalife International Inc Jun 1998 - Oct 2005 - Manager - Global Supply Chain Management
Education:
London School of Economics and Political Science
Diploma, General Course, Social Sciences
New School University
BA, Economics
Phillips Exeter Academy
Diploma, High School
University of California, Los Angeles
Certificate, Accounting
Skills:
Supply Chain, Supply Chain Finance, Demand Planning, Forecasting, Strategic Planning, Strategic Analysis, Manufacturing, Distribution, Logistics, Transportation, Procurement, Raw Materials, Sales Operations, Sales and Operations Planning, Emerging Markets, Food & Beverage, Personal Care, Cosmetics, Consumer Products, FMCG, Business Analysis, SAP, International Project Management, Product Life Cycle Management, Cost Management, Entertainment, Asia Pacific, Europe, Middle East, Latin America, Pharmaceuticals, General Management, Luxury, Strategy, Leadership, Project Planning, Executive Management, Analysis, Product Management, International Business


Brian Lee Photo 2
Trainee In Commercial Programs At Pzl Mielec, A Sikorsky Company

Trainee In Commercial Programs At Pzl Mielec, A Sikorsky Company

Position:
Management at New Hong Kong House, Inc
Location:
Greater New York City Area
Industry:
Defense & Space
Work:
New Hong Kong House, Inc since May 2011 - Management PZL Mielec, A Sikorsky Company - Mielec, Poland Jul 2012 - Aug 2012 - Trainee in Commercial Programs GLOCK, Inc. - Smyrna, GA May 2012 - Jul 2012 - GSSF Intern
Education:
Yale University 2010 - 2014
Bachelor of Arts in Political Science
Kent School 2006 - 2010
Languages:
English, Fujianese


Brian Lee Photo 3
Associate At Tishman Speyer

Associate At Tishman Speyer

Position:
Associate at Tishman Speyer
Location:
New York, New York
Industry:
Real Estate
Work:
Tishman Speyer - New York, NY since Sep 2011 - Associate New York City Economic Development Corporation Jun 2010 - Aug 2010 - Summer Associate UBS Jan 2007 - Apr 2009 - Associate Director UBS Oct 2006 - Dec 2006 - Equities Research Analyst UBS Jul 2004 - Sep 2006 - Equities Trader
Education:
University of Pennsylvania - The Wharton School 2009 - 2011
MBA, Real Estate
Yale University 2000 - 2004
B.A., Political Science, International Studies
Kingswood-Oxford School 1996 - 2000


Brian Lee Photo 4
Quality Assurance Analyst At Wireless Generation

Quality Assurance Analyst At Wireless Generation

Position:
Quality Assurance Analyst at Amplify Education
Location:
Greater New York City Area
Industry:
Computer Software
Work:
Amplify Education since Jun 2012 - Quality Assurance Analyst IDI Billing Solutions - Victor, NY May 2011 - Nov 2011 - Quality Assurance co-op Welch Allyn Sep 2009 - Feb 2010 - R&D Verification and Validation Co-op
Education:
Rochester Institute of Technology 2006 - 2012
Skills:
Java, C, C++, Python, Visual Studio, Eclipse, ClearQuest, Quality Center, Visio, TFS, SQL, Selenium, PHP, JUnit, Windows, Agile Methodologies, Test Automation, JavaScript, CSS, Testing


Brian Lee Photo 5
Owner At Brian Sh Lee

Owner At Brian Sh Lee

Position:
Owner / Consultant at BRIAN SH LEE
Location:
Greater New York City Area
Industry:
Online Media
Work:
BRIAN SH LEE - New Jersey since Jan 2004 - Owner / Consultant COSCO International - Englewood NJ Jan 1997 - Dec 2003 - Deputy Gen Manager DAEWOO CORPORATION Jul 1993 - Aug 1994 - QA
Education:
Stevens Institute of Technology 1995 - 1996
Master of Science (MS)


Brian Lee Photo 6
Vp At Dresdner-Kleinwort

Vp At Dresdner-Kleinwort

Position:
VP at dresdner-kleinwort
Location:
Greater New York City Area
Industry:
Investment Banking
Work:
dresdner-kleinwort - VP


Brian Lee Photo 7
Teacher At Ridgewood High School

Teacher At Ridgewood High School

Position:
Teacher at Ridgewood High School
Location:
Greater New York City Area
Industry:
Education Management
Work:
Ridgewood High School - Teacher


Brian Lee Photo 8
Financial Director At Fd Worldwide Merchandise Group

Financial Director At Fd Worldwide Merchandise Group

Position:
Financial Director at FD Worldwide Merchandise Group
Location:
Greater New York City Area
Industry:
Wholesale
Work:
FD Worldwide Merchandise Group - Financial Director


Brian Joseph Lee Photo 9
Brian Joseph Lee, New York NY - Lawyer

Brian Joseph Lee, New York NY - Lawyer

Address:
Milbank, Tweed, Hadley & Mccloy LLP
1 Chase Manhattan Plz FL 48, New York 10005
(212) 530-5264
Licenses:
New York - Due to reregister within 30 days of birthday 2009
Education:
Fordham University School of Law
Specialties:
Banking - 50%
Energy / Utilities - 50%


Brian Lee Photo 10
Differential Trench Open Process

Differential Trench Open Process

US Patent:
6207573, Mar 27, 2001
Filed:
May 19, 1999
Appl. No.:
9/314358
Inventors:
Brian S. Lee - New York NY
Assignee:
Infineon Technologies North America Corp. - San Jose CA
International Classification:
H01L21/311
US Classification:
438700
Abstract:
In accordance with the invention, a method for opening holes for semiconductor fabrication includes the steps of providing a pad stack on a substrate, forming a hard mask layer on the pad stack, the hard mask layer selectively removable relative to the pad stack, patterning a resist layer on the hard mask layer, the resist layer being selectively removable relative to the hard mask layer and having a thickness sufficient to prevent scalloping, etching the hard mask layer selective to the resist layer down to the pad stack, removing the resist layer. After removing the resist layer, the pad stack is etched selective to the hard mask layer such that a hole is opened down to the substrate.