Inventors:
Masayuki Iijima - Nagano, JP
Tomoaki Ikeda - Nagano, JP
Masashi Miyazawa - Nagano, JP
Kouji Ueno - Nagano, JP
Paul J. Gwin - Orangevale CA, US
Brian J. Long - Folsom CA, US
Peter A. Davison - Puyallup WA, US
Rolf A. Konstad - Gold River CA, US
Assignee:
Sanyo Denki Co., Ltd. - Tokyo
Intel Corporation - Santa Clara CA
International Classification:
F28F 7/00, F28D 15/00, H05K 7/20
Abstract:
A small water-cooling type electronic component cooling apparatus is provided. The electronic component cooling apparatus comprises a so-called water-cooling heat sink , a radiator cooled by an electric fan , first and second coolant paths for circulating a coolant between the heat sink and the radiator , and an electric pump to supply a moving energy to the coolant. The electric pump is arranged at a position facing the heat-radiating portion of the radiator.