BHARAT PATEL, RPH
Pharmacy at Sweet Cherry Ln, Westland, MI

6623651, Sep 23, 2003

Mar 22, 2001

09/815364

Bharat Patel - Canton MI
Jay D. Baker - Dearborn MI
Mohan Paruchuri - Canton MI

Visteon Global Technologies, Inc. - Dearborn MI

H01B 1300

216 13, 174254

A method for making a multi-layer electronic circuit board having at least one electrically conductive protuberance which forms a “via” and which traverses through the various layers of the electric circuit board , and further having at least one interconnection portion which supports a wide variety of components and interconnection assemblies.

6585538, Jul 1, 2003

Apr 20, 2000

09/553296

Harvinder Singh - Shelby Township MI
Vijay Patel - Westland MI
Michael Howey - Canton MI
Bharat Patel - Canton MI
Jin Zhou - Troy MI

Visteon Global Technologies, Inc. - Dearborn MI

H01R 907

439495, 439564, 361785

A connector system for printed circuit boards uses extensions of the traces of the printed circuit board as connector pins by supporting the malleable traces with isolated support pillars. This eliminates the need for electrical junctions between the connector and the printed circuit board. The support pillars provide the necessary mechanical properties for the connector pins. The conductive trace may be adhered to one side of the support or may be draped over the top to cover both sides and may be plated with the material of the support to provide a uniform electrical conductivity over the surface of the formed pin.

6739041, May 25, 2004

Mar 22, 2001

09/815234

Bharat Z. Patel - Canton MI
Jay D. Baker - Dearborn MI
Mohan R. Paruchuri - Canton MI

Visteon Global Tech., Inc. - Dearborn MI

H05K 320

29831, 29846, 29852, 29847, 29845, 29825

A method for making a multi-layer electronic circuit board including the steps of forming at least one protuberance upon an electrically conductive member and adding additional electrically conductive layers of material to the member while selectively extending the protuberance within the layers , thereby forming a circuit board. A portion of the formed circuit board may be etched in order to selectively create air-bridges or interconnection portions.

6357414, Mar 19, 2002

Apr 20, 2000

09/553009

Pawel Kalinowski - Birmingham MI
Bharat Z. Patel - Canton MI
Timothy J. Yerdon - Plymouth MI
John Trublowski - Troy MI
Prathap A. Reddy - Farmington Hills MI
Harvinder Singh - Shelby Township MI

Visteon Global Technologies, Inc. - Dearborn MI

F01P 106

123198E

Central mounting of control electronics proximate to the engine is provided by attaching the electronics to an upper surface of the intake manifold to provide heat shielding and heat conduction for active components on the circuit card. The central location provides extremely short harnesses to important actuators located in cylinder heads of the engine thus reducing wiring clutter and cost.

6673723, Jan 6, 2004

Mar 22, 2001

09/815226

Bharat Z. Patel - Canton MI 48187
Jay D. Baker - Dearborn MI 48121
Lakhi N. Goenka - Ann Arbor MI 48103
Michael Allen Howey - Canton MI 48187
Mohan R. Paruchuri - Canton MI 48187
Richard Keith McMillan - Dearborn MI 48124

H01L 21302

438745, 438750, 438753, 216 13

A method for making a multi-layer circuit board having at least one electrically conductive interconnection portion or “via” which extends within the board and at least one air-bridge The method includes the steps of forming protuberances upon a core member attaching pre-circuit assemblies to the core member thereby forming the circuit board while concomitantly and selectively extending at least one of the protuberances within the formed circuit board.