BENJAMIN LEE, M.D.
Radiology at 68 St, New York, NY
License number
New York 25MA08573300
Category
Radiology
Type
Thoracic Surgery (Cardiothoracic Vascular Surgery)
Address
Address
525 E 68Th St, New York, NY 10065
Phone
(212) 746-5043
(646) 962-0203 (Fax)
(646) 962-0203 (Fax)
Personal information
See more information about BENJAMIN LEE at radaris.comName
Address
Phone
435 E 30Th St #1002, New York, NY 10016
425 E 79Th St APT 3E, New York, NY 10075
425 E 79Th St APT 7D, New York, NY 10075
4544 158Th St, Flushing, NY 11358
575 Budds Corners Rd, Red Hook, NY 12571
Organization information
See more information about BENJAMIN LEE at bizstanding.comBENJAMIN LEE PRODUCTION INC
396 Broadway ROOM 402, New York, NY 10013
Status:
Inactive
Inactive reason:
Dissolution by Proclamation / Annulment of Authority
Registration:
Apr 25, 1990
Inactive since:
Sep 28, 1994
State ID:
1441895
Business type:
DOMESTIC BUSINESS CORPORATION
Professional information
See more information about BENJAMIN LEE at trustoria.com
Independent Music Professional
Independent Music Professional
Position:
music director/board member at Vaudeville Arts Alliance, Inc.
Location:
Greater New York City Area
Industry:
Music
Work:
Vaudeville Arts Alliance, Inc.
- NYC since Jan 2010
-
music director/board member
Education:
UNC Greensboro
BA, Music
BA, Music
Research Staff Member At Ibm
Research Staff Member At Ibm
Position:
Research Staff Member at IBM
Location:
Greater New York City Area
Industry:
Research
Work:
IBM
since Dec 2010
-
Research Staff Member
IBM
May 2009 - Dec 2010
-
Post-Doctoral Researcher
IBM
Jun 2008 - Aug 2008
-
Research Intern
Southwest Research Institute
May 2002 - Jan 2003
-
Student Engineer
Education:
Columbia University in the City of New York 2004 - 2009
Ph.D., Electrical Engineering Columbia University - Fu Foundation School of Engineering and Applied Science 2004 - 2006
M.S., Electrical Engineering Oklahoma State University 1999 - 2004
B.S., Electrical Engineering
Ph.D., Electrical Engineering Columbia University - Fu Foundation School of Engineering and Applied Science 2004 - 2006
M.S., Electrical Engineering Oklahoma State University 1999 - 2004
B.S., Electrical Engineering
Skills:
High Performance Computing, Matlab, Testing, Physics, CMOS, Algorithms, Labview, Optics, LaTeX, Thin Films, Computer Architecture, Simulations
Clerk At St. John's University
Clerk At St. John's University
Position:
Clerk at St. John's University
Location:
Greater New York City Area
Industry:
Facilities Services
Work:
St. John's University
-
Clerk
Education:
Saint John's University 1995 - 2002
Assistant Vice President, Implementation At Deutsche Bank
Assistant Vice President, Implementation At Deutsche Bank
Position:
Assistant Vice President, Implementation at Deutsche Bank
Location:
Greater New York City Area
Industry:
Banking
Work:
Deutsche Bank
-
Assistant Vice President, Implementation
Professor At New School
Professor At New School
Position:
professor at new school
Location:
Greater New York City Area
Industry:
Education Management
Work:
new school
-
professor
Pharmaceuticals Professional
Pharmaceuticals Professional
Location:
Greater New York City Area
Industry:
Pharmaceuticals
Benjamin J. Lee, New York NY - Lawyer
Benjamin J. Lee, New York NY - Lawyer
Address:
Office of Attorney General
120 Broadway FL 3, New York 10271
(212) 416-8300
120 Broadway FL 3, New York 10271
(212) 416-8300
Licenses:
New York - Currently registered 1993
Education:
New York University School of Law
Designing Photonic Switching Systems Utilizing Equalized Drivers
Designing Photonic Switching Systems Utilizing Equalized Drivers
US Patent:
2014006, Mar 6, 2014
Filed:
Sep 5, 2012
Appl. No.:
13/604337
Inventors:
Benjamin G. Lee - New York NY, US
Jonathan E. Proesel - Yorktown Heights NY, US
Alexander V. Rylyakov - Mount Kisco NY, US
Clint L. Schow - Ossining NY, US
Jonathan E. Proesel - Yorktown Heights NY, US
Alexander V. Rylyakov - Mount Kisco NY, US
Clint L. Schow - Ossining NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G06F 17/50
US Classification:
716111
Abstract:
Designing a photonics switching system is provided. A photonic switch diode is designed to attain each performance metric in a plurality of performance metrics associated with a photonic switching system based on a weighted value corresponding to each of the plurality of performance metrics. A switch driver circuit is selected from a plurality of switch driver circuits for the photonic switching system. It is determined whether each performance metric associated with the photonic switching system meets or exceeds a threshold value corresponding to each of the plurality of performance metrics based on the photonic switch diode designed and the switch driver circuit selected. In response to determining that each performance metric associated with the photonic switching system meets or exceeds the threshold value corresponding to each of the performance metrics, the photonic switching system is designed using the photonic switch diode designed and the switch driver circuit selected.
Photonic Modulator With Forward-And Reverse-Biased Diodes For Separate Tuning And Modulating Elements
Photonic Modulator With Forward-And Reverse-Biased Diodes For Separate Tuning And Modulating Elements
US Patent:
2014005, Feb 20, 2014
Filed:
Aug 17, 2012
Appl. No.:
13/588871
Inventors:
Benjamin G. Lee - New York NY, US
Jeffrey A. Kash - Pleasantville NY, US
Alexander V. Rylyakov - Mount Kisco NY, US
Clint L. Schow - Ossining NY, US
Jeffrey A. Kash - Pleasantville NY, US
Alexander V. Rylyakov - Mount Kisco NY, US
Clint L. Schow - Ossining NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G02F 1/025, G02F 1/015
US Classification:
385 2, 359245
Abstract:
A method and structure for a modulator which includes a forward-biased diode optimized for power and area to perform a tuning function, and a reverse-biased diode optimized for speed to perform a modulation function.
Flip-Chip Packaging For Dense Hybrid Integration Of Electrical And Photonic Integrated Circuits
Flip-Chip Packaging For Dense Hybrid Integration Of Electrical And Photonic Integrated Circuits
US Patent:
2012020, Aug 16, 2012
Filed:
Feb 16, 2011
Appl. No.:
13/028814
Inventors:
FUAD E. DOANY - KATONAH NY, US
BENJAMIN G. LEE - NEW YORK NY, US
CLINT L. SCHOW - OSSINING NY, US
BENJAMIN G. LEE - NEW YORK NY, US
CLINT L. SCHOW - OSSINING NY, US
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION - ARMONK NY
International Classification:
G02B 6/12, H01L 33/48
US Classification:
385 14, 438 25, 257E33056
Abstract:
A chip system and method includes a photonics chip and an electrical integrated circuit (IC) flip-chip coupled to the photonics chip to form an optochip. The IC or the photonics chip includes an array of bond pads for attachment to the other. The optochip has an array of bond pads for subsequent attachment to a carrier where the photonics chip includes an exposed edge to connect with at least one waveguide.