ANDREW P BOOTH
Engineering in Saint George, VT
License number
Massachusetts 35430
Issued Date
Aug 9, 1990
Expiration Date
Jun 30, 2018
Type
Mechanical Engineer
Address
Address
Saint George, VT 05495
Professional information
Method And Apparatus Of Connection To An Electrical Film Device
US Patent:
6530776, Mar 11, 2003
Filed:
Oct 9, 2001
Appl. No.:
09/972166
Inventors:
Jim Pilavdzic - Milton VT
Andrew Booth - Williston VT
Andrew Booth - Williston VT
Assignee:
Husky Injection Molding Systems, Ltd. - Bolton
International Classification:
B29C 4520
US Classification:
425549, 26432815, 425572
Abstract:
A method and apparatus for connection of a conductor to a thick film pad is disclosed. Pressure and frictional force are combined to produce a reliable metallurgical bond between the conductor and the thick film pad.
Thick Film Heater Apparatus
US Patent:
7241131, Jul 10, 2007
Filed:
Jun 19, 2000
Appl. No.:
09/596549
Inventors:
Andrew Booth - Williston VT, US
Harold Warren - Sugar Grove NC, US
Wink Winkelmann - Boonb NC, US
Edward Jenko - Essey Junction VT, US
Jim Pilavdzic - Milton VT, US
Harold Warren - Sugar Grove NC, US
Wink Winkelmann - Boonb NC, US
Edward Jenko - Essey Junction VT, US
Jim Pilavdzic - Milton VT, US
Assignee:
Husky Injection Molding Systems Ltd.
International Classification:
B29C 45/74, H05B 3/16
US Classification:
425549, 425186, 425192 R, 425547, 425DIG 13, 219543, 338309, 392480
Abstract:
A thick-film electric heater having thick-film layers applied directly on a thermally conductive non-flat substrate. Preferably, the substrate is cylindrically shaped. A dielectric layer is silk-screened on the substrate surface. A resistive layer is silk-screened on the dielectric layer to form a circuit for the generation of heat. The resistive layer has at least one resistive trace in a pattern that is discontinuous circumferentially. At least a pair of silk-screened contact pads are applied in electrical communication with the resistive layer for electrical connection to a power source. An insulation layer is applied over the resistive layer.