ANDREW NORMAN ERICKSON
Pilots at Medcliff Rd, Santa Barbara, CA
License number
California A5136224
Issued Date
Jul 2015
Expiration Date
Jul 2017
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
2545 Medcliff Rd, Santa Barbara, CA 93109
Professional information
Owner, Multiprobe
Position:
CEO/Founder at Multiprobe
Location:
Santa Barbara, California Area
Industry:
Semiconductors
Work:
Multiprobe
- Santa Barbara, California Area since Feb 2001
-
CEO/Founder
YPO-WPO
2006 - 2009
-
member
Veeco Instruments
Jul 1998 - Feb 2001
-
Sr Apps Engineer
Digital Instruments
- Santa Barbara, California Area Jun 1995 - Jun 1998
-
Applications Engineer
Intel
Jun 1992 - Dec 1994
-
Engineering intern
BioMagnetic Technologies
1988 - 1990
-
Research Scientist
Education:
University of Utah 1993 - 1995
MS, Electrical Engineering University of California, San Diego 1986 - 1988
BS, Physics High School 1977 - 1981
MS, Electrical Engineering University of California, San Diego 1986 - 1988
BS, Physics High School 1977 - 1981
Skills:
Entrepreneurship, AFM, Semiconductors, Microscopy, Entrepreneur, Nanotechnology, Start-ups, Product Development, Electronics
Interests:
Family and Relationships, Elementary School and my very cute kids, Organic and M&A Business Growth
Languages:
Spanish
Apparatus And Method For Combined Micro-Scale And Nano-Scale C-V, Q-V, And I-V Testing Of Semiconductor Materials
US Patent:
2012014, Jun 14, 2012
Filed:
Feb 16, 2012
Appl. No.:
13/398681
Inventors:
Andrew N. Erickson - Santa Barbara CA, US
Assignee:
MULTIPROBE, INC. - Santa Barbara CA
International Classification:
G01R 27/26, G01R 1/067
US Classification:
324683, 324149
Abstract:
Current Voltage and Capacitance Voltage (IV and CV) measurements are critical in measurement of properties of electronic materials especially semiconductors. A semiconductor testing device to accomplish IV and CV measurement supports a semiconductor wafer and provides a probe for contacting a surface on the wafer under control of an atomic Force Microscope or similar probing device for positioning the probe to a desired measurement point on the wafer surface. Detection of contact by the probe on the surface is accomplished and test voltage is supplied to the semiconductor wafer. A first circuit for measuring capacitance sensed by the probe based on the test voltage and a complimentary circuit for measuring Fowler Nordheim current sensed by the probe based on the test voltage are employed with the probe allowing the calculation of characteristics of the semiconductor wafer based on the measured capacitance and Fowler Nordheim current.
Method And Apparatus For High Resolution Profiling In Semiconductor Structures
US Patent:
6287880, Sep 11, 2001
Filed:
Dec 29, 2000
Appl. No.:
9/751728
Inventors:
Andrew Norman Erickson - Santa Barbara CA
Peter De Wolf - Santa Barbara CA
Peter De Wolf - Santa Barbara CA
Assignee:
Veeco Instruments Inc. - Plainview NY
International Classification:
G01R 3126
US Classification:
438 17
Abstract:
A method for determining the characteristics of a doped semiconductor substrate is disclosed, wherein a scanning probe microscope, preferably an atomic force microscope, is used to move a probe across a sample surface gathering electrical measurements at many locations. The probe tip is conductive and is connected to a control circuit that applies a voltage to the probe and to an electrode fixed to the semiconductor substrate. Preferably, the current that flows through the sample is measured and saved, together with the position of the probe on the surface of the sample. In this manner, the characteristics of the doped sample can be determined at many different locations with many different degrees of doping. The sample is prepared by doping its top surface, then machining off the top surface to provide access to the sample at different doping depths. By driving the probe back and forth across the surface and taking readings of the sample at many different locations, a map of the electrical,characteristics at various doping depths below the top surface can be developed.
Apparatus And Method For Combined Micro-Scale And Nano-Scale C-V, Q-V, And I-V Testing Of Semiconductor Materials
US Patent:
2010014, Jun 17, 2010
Filed:
Jul 18, 2007
Appl. No.:
11/779282
Inventors:
Andrew N. Erickson - Santa Barbara CA, US
Assignee:
MULTIPROBE, INC. - Santa Barbara CA
International Classification:
G01R 31/02, G01R 31/26, G01R 27/26
US Classification:
324758, 324765, 324690
Abstract:
Current Voltage and Capacitance Voltage (IV and CV) measurements are critical in measurement of properties of electronic materials especially semiconductors. A semiconductor testing device to accomplish IV and CV measurement supports a semiconductor wafer and provides a probe for contacting a surface on the wafer under control of an atomic Force Microscope or similar probing device for positioning the probe to a desired measurement point on the wafer surface. Detection of contact by the probe on the surface is accomplished and test voltage is supplied to the semiconductor wafer. A first circuit for measuring capacitance sensed by the probe based on the test voltage and a complimentary circuit for measuring Fowler Nordheim current sensed by the probe based on the test voltage are employed with the probe allowing the calculation of characteristics of the semiconductor wafer based on the measured capacitance and Fowler Nordheim current.
Scanning Spreading Resistance Probe
US Patent:
5710052, Jan 20, 1998
Filed:
Oct 17, 1995
Appl. No.:
8/543979
Inventors:
Roger L. Alvis - Cupertino CA
Andrew N. Erickson - Santa Barbara CA
Andrew N. Erickson - Santa Barbara CA
Assignee:
Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:
H01L 2166, G01R 3126, G01N 2300
US Classification:
437 8
Abstract:
An accurate method of measuring the two-dimensional doping profile of a semiconductor by measuring an electrical parameter along a path of a dopant iso-concentration. Thin vertical or horizontal slices of the semiconductor integrated circuit are provided and are probed to allow the electrical parameter to be measured through a single concentration area.
Software Synchronization Of Multiple Scanning Probes
US Patent:
6951130, Oct 4, 2005
Filed:
Dec 17, 2004
Appl. No.:
11/015945
Inventors:
Casey Patrick Hare - Santa Barbara CA, US
Andrew Norman Erickson - Santa Barbara CA, US
Andrew Norman Erickson - Santa Barbara CA, US
Assignee:
Multiprobe, Inc. - Santa Barbara CA
International Classification:
H01J003/14
US Classification:
73105, 250307, 250306
Abstract:
A method and apparatus for scanning multiple scanning probe microscopes in close proximity, to scan overlapping scan areas at the same time while avoiding collision employs a control system providing drive signals to a first Atomic Force Microscope (AFM) and calculated drive signals to additional AFMs based on the first drive signals and the relative position of the additional AFMs to the first AFM for consistent spaced motion. Scanning and Failure Analysis (FA) probing of multiple feature of interest using multiple APMs allows for reduced time for locating FA features to set up measurements.
Deconvolving Tip Artifacts Using Multiple Scanning Probes
US Patent:
7415868, Aug 26, 2008
Filed:
Mar 20, 2006
Appl. No.:
11/385102
Inventors:
Casey Patrick Hare - Santa Barbara CA, US
Andrew Norman Erickson - Santa Barbara CA, US
Andrew Norman Erickson - Santa Barbara CA, US
Assignee:
Multiprobe, Inc. - Santa Barbara CA
International Classification:
G01B 5/28
US Classification:
73105, 250306, 250307
Abstract:
The present invention comprises an apparatus and a method for using multiple scanning probes to deconvolve tip artifacts in scanning probe microscopes and other scanning probe systems. The invention uses multiple scanning probe tips of different geometries or orientations to scan a feature, such as a semiconductor line or trench, and to display the scan data such that tip artifacts from each tip can be omitted from the measurement by data from the other tips.
Semiconductor Wafer Isolated Transfer Chuck
US Patent:
2013016, Jul 4, 2013
Filed:
Dec 30, 2011
Appl. No.:
13/341777
Inventors:
Andrew N. Erickson - Santa Barbara CA, US
Jeffrey M. Markakis - Santa Barbara CA, US
Anton Riley - Solvang CA, US
Jeffrey M. Markakis - Santa Barbara CA, US
Anton Riley - Solvang CA, US
Assignee:
MULTIPROBE, INC. - Santa Barbara CA
International Classification:
B23B 31/30, B23Q 7/00
US Classification:
279 3, 29559
Abstract:
A semiconductor wafer processing tool has a support structure for a coarse motion positioning system. A measurement head having a rigid super structure is supported from the support structure by vibration isolators and a top plate is mounted to the super structure. A vacuum transfer chuck is releasably carried by the coarse motion positioning system and releasably adherable to the top plate by application of vacuum. The vacuum transfer chuck supports a semiconductor wafer.
Software Synchronization Of Multiple Scanning Probes
US Patent:
7444857, Nov 4, 2008
Filed:
Sep 29, 2005
Appl. No.:
11/240090
Inventors:
Casey Patrick Hare - Santa Barbara CA, US
Andrew Norman Erickson - Santa Barbara CA, US
Andrew Norman Erickson - Santa Barbara CA, US
Assignee:
Multiprobe, Inc. - Santa Barbara CA
International Classification:
G01B 5/28
US Classification:
73105, 250306, 250307
Abstract:
A method and apparatus for scanning multiple scanning probe microscopes in close proximity, to scan overlapping scan areas at the same time while avoiding collision employs a control system providing drive signals to a first Atomic Force Microscope (AFM) and calculated drive signals to additional AFMs based on the first drive signals and the relative position of the additional AFMs to the first AFM for consistent spaced motion. Scanning and Failure Analysis (FA) probing of multiple feature of interest using multiple APMs allows for reduced time for locating FA features to set up measurements.
Software Synchronization Of Multiple Scanning Probes
US Patent:
2004002, Feb 12, 2004
Filed:
Jul 7, 2003
Appl. No.:
10/615223
Inventors:
Casey Hare - Santa Barbara CA, US
Andrew Erickson - Santa Barbara CA, US
Andrew Erickson - Santa Barbara CA, US
International Classification:
G01N013/16
US Classification:
073/105000
Abstract:
A method and apparatus for scanning multiple scanning probe microscopes in close proximity, to scan overlapping scan areas at the same time while avoiding collision employs a control system providing drive signals to a first Atomic Force Microscope (AFM) and calculated drive signals to additional AFMs based on the first drive signals and the relative position of the additional AFMs to the first AFM for consistent spaced motion. Scanning and Failure Analysis (FA) probing of multiple feature of interest using multiple APMs allows for reduced time for locating FA features to set up measurements.