ANDERS PRESTON PEDERSEN
Pilots at Peacock Dr, Melbourne, FL
License number
Florida A4300639
Issued Date
May 2015
Expiration Date
May 2017
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
3827 Peacock Dr, Melbourne, FL 32904
Personal information
See more information about ANDERS PRESTON PEDERSEN at radaris.comName
Address
Phone
3827 Peacock Dr, Melbourne, FL 32904
Melbourne, FL
3827 Peacock Ave, Melbourne, FL 32904
1398 Meadowbrook Rd, Palm Bay, FL 32905
Professional information
See more information about ANDERS PRESTON PEDERSEN at trustoria.com
Senior Manager, Strategic Sourcing At Harris Corporation
Senior Manager, Strategic Sourcing At Harris Corporation
Position:
Senior Manager, Strategic Sourcing at Harris Corporation
Location:
Melbourne, Florida Area
Industry:
Military
Work:
Harris Corporation
- Melbourne, Florida Area since Dec 2010
-
Senior Manager, Strategic Sourcing
Harris Corporation
Jul 2007 - May 2012
-
Strategic Sourcing, Category Manager
Harris Corporation
Apr 1987 - Jun 2007
-
Engineer, Printed Wiring Boards
Education:
University of Central Florida 1987 - 1989
MBA, Business University of Michigan 1982 - 1986
BSME, Mechanical Engineering
MBA, Business University of Michigan 1982 - 1986
BSME, Mechanical Engineering
Method Of Making Printed Wiring Board With Enhanced Structural Integrity
Method Of Making Printed Wiring Board With Enhanced Structural Integrity
US Patent:
7948766, May 24, 2011
Filed:
Jul 16, 2009
Appl. No.:
12/504251
Inventors:
Gregory M. Jandzio - Melbourne FL, US
Anders P. Pedersen - Palm Bay FL, US
Gary A. Rief - Melbourne FL, US
Walter M. Whybrew - Palm Bay FL, US
Anders P. Pedersen - Palm Bay FL, US
Gary A. Rief - Melbourne FL, US
Walter M. Whybrew - Palm Bay FL, US
Assignee:
Harris Corporation - Melbourne FL
International Classification:
H05K 7/02, H05K 7/06, H05K 7/08, H05K 7/10
US Classification:
361760, 361761, 361763
Abstract:
A method is for making a structural printed wiring board panel that includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel.
Printed Circuit Board (Pcb)With Enhanced Structural Integrity
Printed Circuit Board (Pcb)With Enhanced Structural Integrity
US Patent:
7907417, Mar 15, 2011
Filed:
Jan 17, 2008
Appl. No.:
12/015541
Inventors:
Gregory M. Jandzio - Melbourne FL, US
Anders P. Pedersen - Palm Bay FL, US
Gary A. Rief - Melbourne FL, US
Walter M. Whybrew - Palm Bay FL, US
Anders P. Pedersen - Palm Bay FL, US
Gary A. Rief - Melbourne FL, US
Walter M. Whybrew - Palm Bay FL, US
Assignee:
Harris Corporation - Melbourne FL
International Classification:
H05K 7/02, H05K 7/06, H05K 7/08, H05K 7/10
US Classification:
361760, 361761, 361763
Abstract:
A printed circuit board (PCB) is disclose such that the PCB has enhanced structural integrity. The PCB has opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel.
Microwave Device Having A Slotted Coaxial Cable-To-Microstrip Connection And Related Methods
Microwave Device Having A Slotted Coaxial Cable-To-Microstrip Connection And Related Methods
US Patent:
6894582, May 17, 2005
Filed:
Feb 7, 2003
Appl. No.:
10/360330
Inventors:
Walter M. Whybrew - Palm Bay FL, US
Gregory H. Marquardt - West Melbourne FL, US
Anders P. Pedersen - Palm Bay FL, US
Jay D. Warshowsky - Melbourne Beach FL, US
Gregory H. Marquardt - West Melbourne FL, US
Anders P. Pedersen - Palm Bay FL, US
Jay D. Warshowsky - Melbourne Beach FL, US
Assignee:
Harris Corporation - Melbourne FL
International Classification:
H01R009/09
US Classification:
333 33, 333260, 439 63, 439581
Abstract:
A microwave device includes a circuit board having a microstrip layer, a ground plane, and a dielectric layer therebetween. The circuit board has a shield receiving slot for longitudinally receiving the end of a shield conductor of a coaxial cable. The coaxial cable also has an inner conductor having an end that extends longitudinally outwardly from the end of the shield conductor. The microstrip layer has an inner conductor contact adjacent the shield receiving slot that connects to the end of the inner conductor. The device may include a conductive layer in the shield receiving slot to connect to the ground plane. The shield receiving slot may have a T shape and extend through the circuit board. The device may include a mounting fixture connecting an end of the shield conductor to the circuit board.
Electronic Device With Edge Surface Antenna Elements And Related Methods
Electronic Device With Edge Surface Antenna Elements And Related Methods
US Patent:
8217842, Jul 10, 2012
Filed:
Sep 22, 2011
Appl. No.:
13/240376
Inventors:
Anders P. Pedersen - Palm Bay FL, US
Daniel A. Robison - Palm Bay FL, US
Alan Mast - Melbourne Beach FL, US
Daniel A. Robison - Palm Bay FL, US
Alan Mast - Melbourne Beach FL, US
Assignee:
Harris Corporation - Melbourne FL
International Classification:
H01Q 1/38
US Classification:
343700MS, 29600
Abstract:
An electronic device may include a multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces, wireless processing circuitry on at least one of the opposing major surfaces, and an antenna element on at least one of the edge surfaces. The multilayer circuit board may include a conductive trace coupling the antenna element to the wireless processing circuitry.
Printed Wiring Board With Enhanced Structural Integrity
Printed Wiring Board With Enhanced Structural Integrity
US Patent:
7499287, Mar 3, 2009
Filed:
Jan 17, 2008
Appl. No.:
12/015535
Inventors:
Gregory M. Jandzio - Melbourne FL, US
Anders P. Pedersen - Palm Bay FL, US
Gary A. Rief - Melbourne FL, US
Walter M. Whybrew - Palm Bay FL, US
Anders P. Pedersen - Palm Bay FL, US
Gary A. Rief - Melbourne FL, US
Walter M. Whybrew - Palm Bay FL, US
Assignee:
Harris Corporation - Melbourne FL
International Classification:
H05K 7/02, H05K 7/06, H05K 7/08, H05K 7/10
US Classification:
361760, 361780, 361792
Abstract:
A structural printed wiring board panel includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel.
Printed Wiring Board With Enhanced Structural Integrity
Printed Wiring Board With Enhanced Structural Integrity
US Patent:
7342801, Mar 11, 2008
Filed:
Apr 29, 2004
Appl. No.:
10/835251
Inventors:
Gregory M. Jandzio - Melbourne FL, US
Anders P. Pedersen - Palm Bay FL, US
Gary A. Rief - Melbourne FL, US
Walter M. Whybrew - Palm Bay FL, US
Anders P. Pedersen - Palm Bay FL, US
Gary A. Rief - Melbourne FL, US
Walter M. Whybrew - Palm Bay FL, US
Assignee:
Harris Corporation - Melbourne FL
International Classification:
H05K 7/02, H05K 7/06, H05K 7/08, H05K 7/10
US Classification:
361760, 361780, 361782
Abstract:
A structural printed wiring board panel includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel.
Conductor-Within-A-Via Microwave Launch
Conductor-Within-A-Via Microwave Launch
US Patent:
6937120, Aug 30, 2005
Filed:
Apr 2, 2003
Appl. No.:
10/405792
Inventors:
Charles Robert Fisher - Satellite Beach FL, US
Anders P. Pedersen - Palm Bay FL, US
Walter M. Whybrew - Palm Bay FL, US
Anders P. Pedersen - Palm Bay FL, US
Walter M. Whybrew - Palm Bay FL, US
Assignee:
Harris Corporation - Melbourne FL
International Classification:
H01P003/08, H01P001/04
US Classification:
333246, 333260, 174266
Abstract:
A concentric ‘conductor within a via’ RF interconnect architecture, has an inner via through which at least one RF signal conductor passes. The inner conductive via is coaxially formed within and stably coaxially aligned within an outer conductive via, which serves as a coaxial ground plane that completely surrounds the inner conductive via. The outer conductive via passes through dielectric layers of microstrip or stripline structures on opposite sides of a multi printed circuit laminate.
Printed Wiring Board Assembly And Related Methods
Printed Wiring Board Assembly And Related Methods
US Patent:
8572841, Nov 5, 2013
Filed:
Mar 19, 2008
Appl. No.:
12/051133
Inventors:
Anders P. Pedersen - Palm Bay FL, US
Daniel A. Robison - Palm Bay FL, US
Alan W. Mast - Melbourne Beach FL, US
Daniel A. Robison - Palm Bay FL, US
Alan W. Mast - Melbourne Beach FL, US
Assignee:
Harris Corporation - Melbourne FL
International Classification:
H05K 3/30
US Classification:
29834, 29832, 29846, 174260
Abstract:
A method is for making a printed wiring board (PWB) assembly. The method may include forming a first PWB having a plurality of first electrically conductive pads, forming a second PWB including a plurality of electrically conductive traces having exposed ends on an edge surface of the second PWB, and covering the edge surface of the second PWB with an electrically conductive layer. The method may also include selectively removing portions of the electrically conductive layer to define a plurality of second electrically conductive pads electrically connected to corresponding ones of the exposed ends of the electrically conductive traces, and assembling the first and second PWBs together so that the first and second electrically conductive pads are electrically coupled together to define the PWB assembly.
Electronic Device With Edge Surface Antenna Elements And Related Methods
Electronic Device With Edge Surface Antenna Elements And Related Methods
US Patent:
8044861, Oct 25, 2011
Filed:
Jun 30, 2008
Appl. No.:
12/164756
Inventors:
Anders P. Pedersen - Palm Bay FL, US
Daniel A. Robison - Palm Bay FL, US
Alan Mast - Melbourne Beach FL, US
Daniel A. Robison - Palm Bay FL, US
Alan Mast - Melbourne Beach FL, US
Assignee:
Harris Corporation - Melbourne FL
International Classification:
H01Q 1/38
US Classification:
343700MS, 343853
Abstract:
An electronic device may include a multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces, wireless processing circuitry on at least one of the opposing major surfaces, and an antenna element on at least one of the edge surfaces. The multilayer circuit board may include a conductive trace coupling the antenna element to the wireless processing circuitry.