Inventors:
Alan M. Buchanan - Midvale UT
Jay S. Abramowitz - Salt Lake City UT
Assignee:
Unisys Corporation - Blue Bell PA
International Classification:
H05K 103, B32B 702
Abstract:
A laminated printed wiring board having surfaces thereof fabricated from conventional fiber reinforced laminates which are secured together by means of an adhesive fabricated of a reinforced thermosetting resin having a coefficient of thermal expansion (CTE) which is substantially smaller than the CTE of the surface laminate whereby the apparent CTE of the overall printed wiring board assembly is substantially controlled.